CMP Technology for Semiconductor Device Manufacturing

Diamond semiconductor technology for RF device applications

This paper presents a comprehensive review of diamond electronics from the RF perspective. Our aim was to find and present the potential, limitations and current status of diamond semiconductor devices as well as to investigate its suitability for RF device applications. While doing this, we briefly analysed the physics and chemistry of CVD diamond process for a better understanding of the reas...

Advanced CMP Processes for Special Substrates and for Device Manufacturing in MEMS Applications

The present work reports on studies and process developments to utilize the chemical mechanical planarization (CMP) technology in the field of micro electrical mechanical systems (MEMS). Approaches have been undertaken to enable the manufacturing of thick film SOI (silicon-on-insulator) substrates with a high degree of flatness as well as utilizing CMP for the formation of several novel MEMS de...

A Framework for Semiconductor Manufacturing

Recent Topics in CMP-Related IC Design for Manufacturing

CMP is a planarization technique for multilevel VLSI metallization processes. CMP fills are inserted as a design for manufacturability (DFM) methodology to improve pattern-dependent post-CMP topography, i.e., to improve interconnect planarity. Design-driven fill synthesis seeks to optimize CMP fill with respect to objectives beyond mere density uniformity. Design-driven fill synthesis minimizes...

Exposure assessment for retrospective follow-up studies of semiconductor- and storage device-manufacturing workers.

OBJECTIVE This exposure assessment was conducted in the first large study of mortality and cancer incidence in semiconductor and storage device manufacturing. METHODS Unique combinations of division, department and job codes and names (DDJ) from work history records were assigned to work groups and exposure categories. Agent exposure matrices assessed differences in potential exposures betwee...